It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies. This makes the system a perfect tool and reliable companion as applications migrate from product development to production. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products. We sell our equipment at a fair price, and offer quality technical support, service, spare parts and warranties customers normally expect from Original Equipment Manufacturers (OEMs). We buy and refurbish surplus bonders, inspection systems, dicing systems, testers and more. We stand behind what we sell and will do our best to take the stress out of your purchase. First class service staff - all full time employees not contractors are seasoned industry professionals who will not only help you get your project off the ground, but will keep you running for years to come. Back to login Login here Our chief differentiator is our people. Key Features Specifications Options Downloads.
At its introduction, this innovative platform concept won the prestigious Swiss Technology Award. PDF, ePub, eBook, fb2, mobi, txt, doc, rtf, djvu ▶▷▶▷ esec die bonder manual esec die bonder manual File Name:
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